21.5

21.5" Highest Resolution Pharmacy & Medicine Industry Point of Sale System

HYCP-200
Packing and signing equipment HYCP-200 solves the high-speed collection and real-time labeling integration of FCL products.
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Product Details

With our advanced equipment and exquisite workmanship, we focus on the development and production of SIM Card Punching Machine, Plastic Weilding High Speed Embedding Machine, Round Bottles Labeling Machine through continuous practice and innovation. With professional work, we have injected new vitality into many new and old enterprise brands, effectively enhanced the added value of the brand, expanded the popularity of the enterprise and made the enterprise and brand more outstanding on the broad market stage. We have introduced new development strategies and insisted that we should actively explore new market spaces and seek competitive advantages in new business areas.

Packing Device HYCP-200


Product Description

Packing and signing equipment HYCP-200 solves the high-speed collection and real-time labeling integration of FCL products.


Technical Parameter

Detection Speed :40 Boxes /Min

Bottle Size : 600X400 Mm

Error Detection Rate : ≤5/1000

Power : 220V 50/60HZ,0.5KW

Air Pressure : 0.4~0.6MPa

Dimension : 1500x800x1600mm

Total Weight :120KG

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Although the June Exhibition has ended, the show will never stop.

I sincerely thank every customer and friend who visited the booth for guidance.

Your recognition and trust are the driving force for us to move forward.


We adhere to the faith of integrity, quality and service, and cooperate with many years of manufacturing experience to research, so that the specifications of our 21.5" Highest Resolution Pharmacy & Medicine Industry Point of Sale System are constantly innovating. We'll be your reputable partner and supplier of auto areas and accessories in China. We adhere to the development strategy of 'internationalization, technologicalization and specialization', and vigorously carry out system innovation, management innovation, technological innovation and product innovation to provide high-performance products for global users.

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